Circuposit? 3000-1 from Dupont Dow Rhom Hass Company
2022-03-07 10:11
Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
Key Properties
- Exceptional Interconnect Reliability
- Horizontal or vertical application
- Excellent bath stability and performance
- Reduced bath maintenance
- Reduction in solution volume growth
- Low-build or high-build deposition
酸性鍍銅中間體相關鏈接：
垂直連續電鍍（VCP）高TP值酸性鍍銅光澤劑用電鍍中間體：www.xjren.com.cn/news/170.html
PCB/FPC用高TP值VCP酸性鍍銅光亮劑中間體產品介紹：www.xjren.com.cn/news/30.html
2021年度填孔鍍銅——印刷線路板（PCB，FPC）酸性填孔鍍銅中間體：www.xjren.com.cn/news/283.html
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深圳市同泰化學技術有限公司參加了2021年7月26-28日在廣州保利世貿博覽館舉辦的第十四屆廣州國際表面處理、電鍍、涂裝展覽會，誠邀您蒞臨同泰化學電子展廳參觀指導！電子展廳鏈接：www.xjren.com.cn/news/316.html。
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